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Innovation-Driven Development: Tongyu Technology Secures a New Server Liquid Cooling Patent
2025-02-05
In the data center sector, effective thermal management is critical to ensuring stable server operations. Tongyu Technology’s newly granted patent, "A Liquid Cooling Radiator for Servers," marks another significant breakthrough in our innovation journey. This cutting-edge solution enhances server stability and energy efficiency, setting a new benchmark in cooling technology.
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Tongyu Electronics Liquid Cooling Product Evolution (2020–2024)
2025-01-16
Tongyu Electronics has been at the forefront of developing innovative liquid cooling solutions, delivering cutting-edge thermal management technologies to meet the evolving demands of high-performance computing. This article highlights the key milestones in Tongyu’s liquid cooling product advancements from 2020 to 2024.
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Tongyu Electronics Innovates Server Cooling Technology: Patented All-in-One Liquid Cooling Solution
2024-12-31
In the digital era, as server performance continues to soar, cooling challenges are becoming increasingly evident. Tongyu Electronics has recently secured a forward-thinking utility model patent, offering a new solution to address server cooling issues.
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Tongyu Technology Joins Open Compute Technology Committee (OCTC) to Drive Data Center Liquid Cooling Standards and Innovation
2024-12-23
In July 2024, Tongyu Technology officially became a member of the Open Compute Technology Committee (OCTC). As a committee member, Tongyu will actively participate in the research and development of data center liquid cooling technology standards. This move highlights the company's commitment to driving continuous innovation in thermal management solutions and supporting the green transformat...
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Diamond Heat Sinks: Enhancing Thermal Management in Advanced Packaging
2024-09-05
Cutting-edge technologies like AI, deep learning, and cloud computing rely on high-performance chips. Global tech companies such as Google and Amazon, along with Chinese giants like Huawei and Alibaba, are heavily investing in this field. As Moore's Law slows down, chip technology faces challenges. Advanced packaging techniques, like 2.5D packaging, help integrate multiple chips densely. Diamon...
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