Leave Your Message
AI Server Cooling Challenges: A Battle Between Temperature and Performance

AI Server Cooling Challenges: A Battle Between Temperature and Performance

2025-02-10
AI servers, with their high parallel computing capabilities and densely packed computing nodes, generate significant heat within a confined space. This results in high power consumption. Under heavy load, the heat produced by the server struggles to dissipate effectively, leading to reduced hardware performance or even hardware damage. Therefore, efficient cooling is one of the major challeng...
view detail
Thermal Grease vs. Thermal Gel: A Comparative Guide for Heat Management Applications

Thermal Grease vs. Thermal Gel: A Comparative Guide for Heat Management Applications

2025-01-13
Thermal grease and thermal gel are widely used materials in the field of thermal management, playing crucial roles in heat dissipation and thermal conduction for electronic devices. While both offer thermal conductivity, they differ significantly in terms ...
view detail
Top 10 Materials with the Highest Thermal Conductivity for Heat Dissipation

Top 10 Materials with the Highest Thermal Conductivity for Heat Dissipation

2024-12-31
Thermal conductivity refers to a material's ability to transfer heat. Materials with high thermal conductivity can effectively transfer heat and absorb it quickly from their surroundings. Poor thermal conductors, on the other hand, hinder heat flow and absor...
view detail
Return to Solder Thermal Interface: Intel's Shift from Thermal Paste to Soldering in Core Processors

Return to Solder Thermal Interface: Intel's Shift from Thermal Paste to Soldering in Core Processors

2024-09-05
When it comes to CPUs, most users focus primarily on performance and price, often evaluating processors based on their cost-performance ratio. However, from a manufacturer's perspective, these two factors aren't the only important considerations. Power consumption and heat generation are even more critical issues.
view detail

NEWS