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AI Server Cooling Challenges: A Battle Between Temperature and Performance
2025-02-10
AI servers, with their high parallel computing capabilities and densely packed computing nodes, generate significant heat within a confined space. This results in high power consumption. Under heavy load, the heat produced by the server struggles to dissipate effectively, leading to reduced hardware performance or even hardware damage. Therefore, efficient cooling is one of the major challeng...
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Innovation-Driven Development: Tongyu Technology Secures a New Server Liquid Cooling Patent
2025-02-05
In the data center sector, effective thermal management is critical to ensuring stable server operations. Tongyu Technology’s newly granted patent, "A Liquid Cooling Radiator for Servers," marks another significant breakthrough in our innovation journey. This cutting-edge solution enhances server stability and energy efficiency, setting a new benchmark in cooling technology.
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Tongyu Electronics Liquid Cooling Product Evolution (2020–2024)
2025-01-16
Tongyu Electronics has been at the forefront of developing innovative liquid cooling solutions, delivering cutting-edge thermal management technologies to meet the evolving demands of high-performance computing. This article highlights the key milestones in Tongyu’s liquid cooling product advancements from 2020 to 2024.
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Thermal Grease vs. Thermal Gel: A Comparative Guide for Heat Management Applications
2025-01-13
Thermal grease and thermal gel are widely used materials in the field of thermal management, playing crucial roles in heat dissipation and thermal conduction for electronic devices. While both offer thermal conductivity, they differ significantly in terms ...
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Top 10 Materials with the Highest Thermal Conductivity for Heat Dissipation
2024-12-31
Thermal conductivity refers to a material's ability to transfer heat. Materials with high thermal conductivity can effectively transfer heat and absorb it quickly from their surroundings. Poor thermal conductors, on the other hand, hinder heat flow and absor...
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Tongyu Electronics Innovates Server Cooling Technology: Patented All-in-One Liquid Cooling Solution
2024-12-31
In the digital era, as server performance continues to soar, cooling challenges are becoming increasingly evident. Tongyu Electronics has recently secured a forward-thinking utility model patent, offering a new solution to address server cooling issues.
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Tongyu Technology Joins Open Compute Technology Committee (OCTC) to Drive Data Center Liquid Cooling Standards and Innovation
2024-12-23
In July 2024, Tongyu Technology officially became a member of the Open Compute Technology Committee (OCTC). As a committee member, Tongyu will actively participate in the research and development of data center liquid cooling technology standards. This move highlights the company's commitment to driving continuous innovation in thermal management solutions and supporting the green transformat...
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Tongyu Leading the Way in Cooling Innovation at SuperComputing 2024
2024-12-06
Dates: November 18-21, 2024Location: Georgia World Congress Center | Atlanta, GA
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TONGYU at IBC: Showcasing Advanced Heat Dissipation Solutions
2024-09-05
As the premier event for the global media and entertainment industry, the International Broadcasting Convention (IBC) is set to open next month, bringing together more than 43,000 broadcasters, content creators, rights holders, and service providers. IBC is the leading platform for innovation, driving the latest trends and advancements in content creation, distribution, and technology.
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Diamond Heat Sinks: Enhancing Thermal Management in Advanced Packaging
2024-09-05
Cutting-edge technologies like AI, deep learning, and cloud computing rely on high-performance chips. Global tech companies such as Google and Amazon, along with Chinese giants like Huawei and Alibaba, are heavily investing in this field. As Moore's Law slows down, chip technology faces challenges. Advanced packaging techniques, like 2.5D packaging, help integrate multiple chips densely. Diamon...
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