Leave Your Message

Tongyu Electronics Liquid Cooling Product Evolution (2020–2024)

2025-01-16

Tongyu Electronics has been at the forefront of developing innovative liquid cooling solutions, delivering cutting-edge thermal management technologies to meet the evolving demands of high-performance computing. This article highlights the key milestones in Tongyu’s liquid cooling product advancements from 2020 to 2024.


2020: High-Performance Cooling for CPUs
Intel EGS CPU Liquid Cooling Solution
Material: The cold plate is made of high-quality T2 copper.
Flow Channel Design: 
Features skiving fin technology for superior heat dissipation efficiency.
Welding Process: 
Vacuum brazing ensures high reliability and low thermal resistance.
Pressure Resistance: Designed to withstand 4 Bar, with an extreme limit of 10 Bar.
Cooling Capability: Supports thermal design power (TDP) of up to 500W.

图片1


图片2

AMD SP5 CPU Liquid Cooling Solution
Material: Utilizes T2 copper for the cold plate.
Flow Channel Design: 
Employs skiving fin technology to enhance cooling performance.
Welding Process: Vacuum brazing for excellent reliability and minimal thermal resistance.
Pressure Resistance: Rated for 4 Bar and tested up to 10 Bar.
Cooling Capability: Handles a TDP of up to 600W.


2021: Advanced Solutions for GPUs
NVIDIA H100 GPU Liquid Cooling Solution
Material: T2 copper cold plate.
Flow Channel Design: Introduces T-fin technology for improved heat dissipation.
Welding Process: Vacuum brazing ensures durability and low thermal impedance.
Pressure Resistance: Designed for 4 Bar with a maximum limit of 10 Bar.
Cooling Capability: Efficiently cools GPUs with a TDP of up to 1200W.

图片3


图片4

2024: Breakthrough in High-Power Cooling
3D Vapor Chamber (VC) Liquid Cooling Technology
Material: Combines oxygen-free copper for the cold plate and 3D VC with brazed fins.
Integrated Design: The 3D VC and the oxygen-free copper cover are seamlessly brazed for exceptional thermal performance.
Pressure Resistance: Maintains a design pressure of 4 Bar and withstands up to 10 Bar.
Cooling Capability: Supports high-power applications with a TDP of up to 2000W.

From 2020 to 2024, Tongyu Electronics has consistently pushed the boundaries of liquid cooling technology. Starting with skiving fin solutions for CPUs, advancing to T-fin designs for GPUs, and culminating in the revolutionary 3D VC liquid cooling technology, Tongyu continues to deliver unparalleled performance and reliability. These innovations cater to diverse applications, from CPUs and GPUs to high-power computing needs, making Tongyu a trusted leader in thermal management solutions.

For more information about Tongyu’s liquid cooling products and technologies, contact us today!