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F-YL-00009 Parallel Flow Channel Project Report

F-YL-00009 Parallel Flow Channel Project Report

2024-10-12

Under the IGBT module settings, the specific power is provided by the customer in the CAD drawing:All IGBT heat sources are uniformly set on this IGBT material layer, made of silicon.

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F-YL-00015 Backflow Project Report

F-YL-00015 Backflow Project Report

2024-10-12

The IGBT module is set up as follows, with specific power ratings provided in the CAD diagram from the client. The resistance power is adjusted to 120W.

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I24A7 Liquid Cooling  Project Report

I24A7 Liquid Cooling Project Report

2024-10-12

Design Parameters: Request
CPU Specification: AMD SP5, 400W*2
Ambient Temperature (°C): 35
Cooling Fluid: 25% PGW(Deionized Water + Inhibitor + Biocide)
Inlet Water Temperature (°C):40
Flow Rate (LPM):1.0 series connection

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Changsha (No DIMM) Liquid Cooling Project Report

Changsha (No DIMM) Liquid Cooling Project Report

2024-10-12

CPU Specification:EGS, 385W*2
Ambient Temperature (°C):35
Cooling Fluid:PG25 or Deionized Water
Inlet Water Temperature (°C):40
Flow Rate (LPM):2.4Parallel + Series.

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