
F-YL-00009 Parallel Flow Channel Project Report
2024-10-12
Under the IGBT module settings, the specific power is provided by the customer in the CAD drawing:All IGBT heat sources are uniformly set on this IGBT material layer, made of silicon.

F-YL-00015 Backflow Project Report
2024-10-12
The IGBT module is set up as follows, with specific power ratings provided in the CAD diagram from the client. The resistance power is adjusted to 120W.

I24A7 Liquid Cooling Project Report
2024-10-12
Design Parameters: Request
CPU Specification: AMD SP5, 400W*2
Ambient Temperature (°C): 35
Cooling Fluid: 25% PGW(Deionized Water + Inhibitor + Biocide)
Inlet Water Temperature (°C):40
Flow Rate (LPM):1.0 series connection

Changsha (No DIMM) Liquid Cooling Project Report
2024-10-12
CPU Specification:EGS, 385W*2
Ambient Temperature (°C):35
Cooling Fluid:PG25 or Deionized Water
Inlet Water Temperature (°C):40
Flow Rate (LPM):2.4Parallel + Series.