Under the IGBT module settings, the specific power is provided by the customer in the CAD drawing:All IGBT heat sources are uniformly set on this IGBT material layer, made of silicon.

The IGBT module is set up as follows, with specific power ratings provided in the CAD diagram from the client. The resistance power is adjusted to 120W.

Design Parameters: Request
CPU Specification: AMD SP5, 400W*2
Ambient Temperature (°C): 35
Cooling Fluid: 25% PGW(Deionized Water + Inhibitor + Biocide)
Inlet Water Temperature (°C):40
Flow Rate (LPM):1.0 series connection

CPU Specification:EGS, 385W*2
Ambient Temperature (°C):35
Cooling Fluid:PG25 or Deionized Water
Inlet Water Temperature (°C):40
Flow Rate (LPM):2.4Parallel + Series.

Mainboard thermal source section is modeled as a single thermal resistance.

Preliminary design: Use the two fan models provided by the client, 3004 and 3007. The casing is slightly simplified, and screws, interfaces, and certain components of the mainboard are excluded from the simulation scope. 

Preliminary design: Use the two fan models provided by the client, 3004 and 3007. The casing is slightly simplified, and screws, interfaces, and certain components of the mainboard are excluded from the simulation scope. 

Simulation Parameters:

1. Ambient temperature: 50°C, no external wind.
2. Thermal interface material: 6W.
3. Thermal power dissipation as shown in the figure below.
4. Inlet and outlet ventilation hole opening ratio: 60%.

Diameter: 59.5mm
Material: Aluminum substrate (Series 1)
Heat Power Consumption: 220W
Ambient Temperature: 35℃

Diameter: 59.5mm
Material: Aluminum substrate (Series 1)
Heat Power Consumption: 220W
Ambient Temperature: 35℃

According to the relevant parameters and models provided, the temperature rise can be effectively controlled within 25℃ when using the ambient temperature of 16-20℃.