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D5000 Cooling Simulation Result(Ambient Temperature: 35°C)

2024-10-12

Mainboard thermal source section is modeled as a single thermal resistance.
Preliminary design: Use the two fan models provided by the client, 3004 and 3007. The casing is slightly simplified, and screws, interfaces, and certain components of the mainboard are excluded from the simulation scope.

The thermal interface material has a thermal conductivity of 6 W/(m·K).
50C°Ambient temperature: 50C°
13m/s External wind speed: 13m/s

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Project

Power dissipation

Maximum continuous charging current 1.5c

0.65W

4.5c discharge current

5.8W

5.5c discharge current

8.7W

Maximum continuous discharge current 6c

10.3W

d5000 Cooling Simulation Result(50 degree ambient temperature condition) (19)d5000 Cooling Simulation Result(50 degree ambient temperature condition) (20)d5000 Cooling Simulation Result(50 degree ambient temperature condition) (21)

The simulation boundary conditions are correctly set, and the airflow direction closely approximates the actual application

d5000 Cooling Simulation Result(50 degree ambient temperature condition) (22)d5000 Cooling Simulation Result(50 degree ambient temperature condition) (23)

In a 50°C ambient environment, the cell temperature is excessively high. The following improvements are recommended:
1. Increase the perforation rate of the battery pack casing.
2. Introduce spacing between the cells.
As shown in the diagram:

d5000 Cooling Simulation Result(50 degree ambient temperature condition) (24)