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Project Information

Under the IGBT module settings, the specific power is provided by the customer in the CAD drawing:

Materials and thermal conductivity of the various layers of the IGBT chip.

F-YL-00009 Parallel Flow Channel Project Report (4)F-YL-00015 Backflow Project Report (7)

- IGBT Specific Power

F-YL-00009 Parallel Flow Channel Project Report (8)

Preliminary Design

- 50% ethylene glycol aqueous solution, with an inlet water temperature of 50 degrees, flow rate of 25L/min, and maximum outlet water temperature <=75 degrees.
- The material of the water-cooled plate is set to aluminum 6061.

- Under the initial flow channel design, the middle solder joint is 0.4mm thick, and the gap is 1.2mm with an interlocking fin.

Simulation Results

- Simulation Results: Front Temperature Cloud Map

F-YL-00009 Parallel Flow Channel Project Report (15)F-YL-00009 Parallel Flow Channel Project Report (18)
F-YL-00009 Parallel Flow Channel Project Report (16)

- Water-cooled Plate Temperature Cloud Map, with a maximum temperature of 113.43 degrees in the last IGBT contact area.

F-YL-00009 Parallel Flow Channel Project Report (21)F-YL-00009 Parallel Flow Channel Project Report (20)

- Fluid Temperature Cloud Map 20221202, flow rate 25L/min.
- Inlet water, Temperature 50  degress
- Outlet water, temperature 61 degrees
- Fluid Pressure Cloud Map 20221202, flow rate 25L/min.
- Inlet-outlet water pressure drop: 18.4 KPa.

F-YL-00009 Parallel Flow Channel Project Report (23)F-YL-00009 Parallel Flow Channel Project Report (25)