Project Information
Under the IGBT module settings, the specific power is provided by the customer in the CAD drawing:
Materials and thermal conductivity of the various layers of the IGBT chip.


- IGBT Specific Power

Preliminary Design
- 50% ethylene glycol aqueous solution, with an inlet water temperature of 50 degrees, flow rate of 25L/min, and maximum outlet water temperature <=75 degrees.
- The material of the water-cooled plate is set to aluminum 6061.


- Under the initial flow channel design, the middle solder joint is 0.4mm thick, and the gap is 1.2mm with an interlocking fin.
Simulation Results
- Simulation Results: Front Temperature Cloud Map



- Water-cooled Plate Temperature Cloud Map, with a maximum temperature of 113.43 degrees in the last IGBT contact area.


- Fluid Temperature Cloud Map 20221202, flow rate 25L/min.
- Inlet water, Temperature 50 degress
- Outlet water, temperature 61 degrees
- Fluid Pressure Cloud Map 20221202, flow rate 25L/min.
- Inlet-outlet water pressure drop: 18.4 KPa.

