F-YL-00015 Backflow Project Report
Project Information
The IGBT module is set up as follows, with specific power ratings provided in the CAD diagram from the client. The resistance power is adjusted to 120W.
IGBT Chip Layer Material and Thermal Conductivity


Specific IGBT power rates - Condition 1:42608W

Specific IGBT power rates - Condition 2:46128W
Preliminary Design
- 50% ethylene glycol aqueous solution, with an inlet water temperature of 50 degrees, flow rate of 50L/min, and maximum outlet water temperature <=85 degrees.
- The material of the Water cooling plate is set to aluminum 6063.
- Under the initial flow channel design, the middle solder joint is 0.3mm thick, and the gap is 1.0mm with an interlocking fin.


Simulation Results
- Simulation results for Condition 2: Frontal temperature cloud map, the highest temperature of the IGBT chip is 139.76 degrees, and the central bottom temperature of this IGBT is 92.45 degrees .


- Simulation results for Condition 2: Bottom temperature cloud map


- Simulation results for Condition 2: Water cooling plate temperature cloud map, with the highest temperature being 100.13 degrees Celsius at the contact area of the last IGBT.


- Condition 2 liquid temperature cloud map, December 5, 2022, flow rate 50 L/min.
- Condition 2 liquid pressure cloud map, December 5, 2022, flow rate 50 L/min.


- Simulation results for Condition 1: Frontal temperature cloud map, the highest temperature of the IGBT chip is 147.04 degrees , and the central bottom temperature of this IGBT is 110.56 degrees.


- Simulation results for Condition 1: Bottom temperature cloud map


- Simulation results for Condition 1: Water cooling plate temperature cloud map, with the highest temperature being 106.12 degrees Celsius at the contact area of the last IGBT.


- Condition 1 liquid temperature cloud map,20221206, flow rate 50 L/min.


- Condition 1 liquid pressure cloud map, 20221206, flow rate 50 L/min.