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op6000 Cooling Simulation Result

2024-10-11

The heat source of the motherboard is modeled as a single thermal resistance
Simulation Parameters:
1. Ambient temperature: 50°C, no external wind.
2. Thermal interface material: 6W.
3. Thermal power dissipation as shown in the figure below.
4. Inlet and outlet ventilation hole opening ratio: 60%.

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The hottest point of the device is the components marked on the mainboard. It is recommended to increase the copper plate area and apply heat conductive stickers.

op6000 Cooling Simulation Result (13)op6000 Cooling Simulation Result

Summary: The module meets the temperature requirements.