op6000 Cooling Simulation Result
2024-10-11
The heat source of the motherboard is modeled as a single thermal resistance
Simulation Parameters:
1. Ambient temperature: 50°C, no external wind.
2. Thermal interface material: 6W.
3. Thermal power dissipation as shown in the figure below.
4. Inlet and outlet ventilation hole opening ratio: 60%.










The hottest point of the device is the components marked on the mainboard. It is recommended to increase the copper plate area and apply heat conductive stickers.


Summary: The module meets the temperature requirements.