Tongyu Technology is heading to SC25 in St. Louis to showcase high-performance thermal solutions for AI and HPC platforms. If you’re building accelerator servers or other high-power systems, we’d love to meet and talk through your cooling roadmap.

Dongguan, China – August 2025 – Tongyu Technology is proud to announce a significant milestone: the company has successfully passed the Responsible Business Alliance (RBA) Validated Assessment Program (VAP) audit held on July 17–18, 2025, earning the prestigious Silver Certification with an impressive score of 166.1 out of 200.

In the data center sector, effective thermal management is critical to ensuring stable server operations. Tongyu Technology’s newly granted patent, "A Liquid Cooling Radiator for Servers," marks another significant breakthrough in our innovation journey. This cutting-edge solution enhances server stability and energy efficiency, setting a new benchmark in cooling technology.

Tongyu Electronics has been at the forefront of developing innovative liquid cooling solutions, delivering cutting-edge thermal management technologies to meet the evolving demands of high-performance computing. This article highlights the key milestones in Tongyu’s liquid cooling product advancements from 2020 to 2024.

In the digital era, as server performance continues to soar, cooling challenges are becoming increasingly evident. Tongyu Electronics has recently secured a forward-thinking utility model patent, offering a new solution to address server cooling issues.

In July 2024, Tongyu Technology officially became a member of the Open Compute Technology Committee (OCTC). As a committee member, Tongyu will actively participate in the research and development of data center liquid cooling technology standards. This move highlights the company's commitment to driving continuous innovation in thermal management solutions and supporting the green transformat...

Cutting-edge technologies like AI, deep learning, and cloud computing rely on high-performance chips. Global tech companies such as Google and Amazon, along with Chinese giants like Huawei and Alibaba, are heavily investing in this field. As Moore's Law slows down, chip technology faces challenges. Advanced packaging techniques, like 2.5D packaging, help integrate multiple chips densely. Diamon...