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See You at SC25 — Cooling AI’s Future
2025-10-25
Tongyu Technology is heading to SC25 in St. Louis to showcase high-performance thermal solutions for AI and HPC platforms. If you’re building accelerator servers or other high-power systems, we’d love to meet and talk through your cooling roadmap.
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How to Design a Heatsink and Calculate Thermal Resistance
2025-06-28
When it comes to ensuring the reliability and performance of high-power electronic systems, effective heatsink design plays a critical role. From managing the thermal budget to selecting the right materials and calculating thermal resistance, each design decision impacts overall system stability. This guide explores the essential elements of custom heatsink design and how to optimize thermal ...
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Tongyu Electronic at NVIDIA GTC 2025
2025-03-22
As NVIDIA GTC 2025 spotlights AI's exponential compute demands, Tongyu Electronic is collaborating with global innovators to solve the thermal paradox: how to sustain 100kW+/rack AI workloads while achieving net-zero targets.
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Tongyu Leading the Way in Cooling Innovation at SuperComputing 2024
2024-12-06
Dates: November 18-21, 2024Location: Georgia World Congress Center | Atlanta, GA
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TONGYU at IBC: Showcasing Advanced Heat Dissipation Solutions
2024-09-05
As the premier event for the global media and entertainment industry, the International Broadcasting Convention (IBC) is set to open next month, bringing together more than 43,000 broadcasters, content creators, rights holders, and service providers. IBC is the leading platform for innovation, driving the latest trends and advancements in content creation, distribution, and technology.
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