Nyob rau hauv IGBT module teeb tsa, lub zog tshwj xeeb yog muab los ntawm cov neeg siv khoom hauv CAD daim duab: Txhua qhov IGBT cov khoom siv hluav taws xob tau sib npaug ntawm cov khoom siv IGBT no, ua los ntawm silicon.

Lub IGBT module tau teeb tsa raws li hauv qab no, nrog rau kev ntsuas lub zog tshwj xeeb muab rau hauv CAD daim duab los ntawm tus neeg siv khoom. Lub zog tsis kam yog kho rau 120W.

Design Parameters: Thov
CPU Specification: AMD SP5, 400W * 2
Ambient Kub (°C): 35
Cov dej txias: 25% PGW (Deionized Dej + Inhibitor + Biocide)
Inlet Dej Kub (°C): 40
Flow Rate (LPM): 1.0 series kev sib txuas

CPU Specification: EGS, 385W * 2
Ambient Kub (°C): 35
Cov dej txias: PG25 lossis Deionized Dej
Inlet Dej Kub (°C): 40
Flow Rate (LPM): 2.4Parallel + Series.

Mainboard thermal qhov chaw seem yog ua qauv raws li ib tug thermal kuj.

Kev tsim qauv ua ntej: Siv ob lub kiv cua qauv muab los ntawm tus neeg siv khoom, 3004 thiab 3007. Lub casing yog me ntsis yooj yim, thiab cov ntsia hlau, qhov cuam tshuam, thiab qee yam ntawm lub mainboard raug cais tawm ntawm qhov simulation.

Kev tsim qauv ua ntej: Siv ob lub kiv cua qauv muab los ntawm tus neeg siv khoom, 3004 thiab 3007. Lub casing yog me ntsis yooj yim, thiab cov ntsia hlau, qhov cuam tshuam, thiab qee yam ntawm lub mainboard raug cais tawm ntawm qhov simulation.

Simulation Parameters:

1. Ambient kub: 50 ° C, tsis muaj cua sab nraud.
2. Cov khoom siv thermal interface: 6W.
3. Thermal power dissipation raws li qhia hauv daim duab hauv qab no.
4. Inlet thiab qhov hluav taws xob qhov cua qhov qhib qhov piv: 60%.

Loj: 59.5mm
Khoom siv: Aluminium substrate (Series 1)
Kev siv hluav taws xob kub: 220W
Ambient kub: 35 ℃

Loj: 59.5mm
Khoom siv: Aluminium substrate (Series 1)
Kev siv hluav taws xob kub: 220W
Ambient kub: 35 ℃

Raws li qhov cuam tshuam thiab cov qauv muab, qhov kub thiab txias tuaj yeem tswj tau zoo hauv 25 ℃ thaum siv qhov ntsuas kub ntawm 16-20 ℃.