Computer Liquid Cooler System PS-07 For DDR5

Introducing the PS-07 Liquid Cooler, a cutting-edge water cooling solution specifically tailored for DDR5 memory modules in high-performance computing systems. Designed to meet the rigorous cooling demands of modern memory technology, the PS-07 is engineered using advanced brazing technology, which ensures exceptional thermal efficiency and reliability. With a cooling capacity of 60W, this accessory effectively manages the heat generated by DDR5 modules, preventing overheating and ensuring consistent, stable performance during intensive computing tasks.

Constructed from top-grade AL6063 aluminum and C1100 copper, the PS-07 offers outstanding durability and superior heat dissipation properties. AL6063 provides excellent heat conductivity while maintaining a lightweight structure, and C1100 copper enhances the overall thermal transfer efficiency, making this cooler an ideal solution for long-term use in high-stress environments. The robust materials ensure that the PS-07 stands up to the demands of continuous operation in data centers and high-performance workstations.

Brazing heatsinksTongyu

Installation is made easy and secure with a screw and spring mounting system, providing a reliable and tight fit to the memory modules. This ensures optimal heat transfer and stability, even in environments with fluctuating temperatures or heavy workloads. The PS-07 Liquid Cooler is the perfect choice for professionals and enthusiasts looking to maximize the performance and longevity of their DDR5 memory modules in demanding computing environments such as AI processing, large-scale simulations, and high-end gaming systems.

Brazing heatsinks involves bonding two metal components, such as a heatsink and a base or other part, by heating a filler metal to a temperature below the melting point of the base metals. The filler metal flows into the joint, creating a robust and conductive bond that boosts heat transfer efficiency. This technique is commonly employed in situations that demand high thermal conductivity and durability, particularly in high-power electronics. Due to its excellent thermal performance, brazing is often the method of choice for connecting heatsinks with intricate designs or multiple layers.

Product DescriptionTongyu

Application	DDR5 memory modules
Material	AL6063+C1100
Weight	0.6kg
Power	60W
Sizes	*7011515mm*
Process	Brazing

Application ScenariosTongyu

Application Scenarios for Liquid Cooler PS-07 For DDR5

The PS-07 Liquid Cooler is designed for high-performance computing environments where DDR5 memory modules require effective cooling. It is ideal for data centers, enterprise servers, and high-frequency computing applications, such as artificial intelligence, deep learning, and large-scale data processing. By providing consistent and reliable thermal management, the PS-07 helps to prevent memory overheating and ensures stable performance under intense workloads, making it a critical component for advanced memory systems.