See You at SC25 — Cooling AI’s Future

Tongyu Technology is heading to SC25 in St. Louis to showcase high-performance thermal solutions for AI and HPC platforms. If you’re building accelerator servers or other high-power systems, we’d love to meet and talk through your cooling roadmap.

Event

• Dates: Nov 16–21, 2025

• Venue: America’s Center Convention Complex, St. Louis, MO

• Hall / Booth: Hall 2, Booth 898

What we’re showcasing

• Liquid cold plates (vacuum-brazed / diffusion-bonded), single or dual circuits
• High-performance CPU/GPU heatsinks with skived fins, vapor chambers, and heat pipes
• FSW manifolds and low-ΔP designs for high flow and uniform temperature
• In-house validation: helium leak ≤10⁻⁶ mbar·L/s, flow/pressure tests, flatness control
• Materials & options: Al 6061/3003, copper, custom footprints to your heat map

Why meet Tongyu

• Fast co-design: from thermal targets to channel layout and DFM in days
• Scalable manufacturing with automotive-grade quality systems
• End-to-end delivery: components, testing data, and documentation

Book a meeting

Share your power map, heat flux, and envelope constraints—we’ll prepare concepts in advance.
Contact: info@tongyu-group.com

See you in St. Louis.