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Tongyu Electronic at NVIDIA GTC 2025

2025-03-22

Redefining Thermal Innovation for AI Compute Density 

As NVIDIA GTC 2025 spotlights AI's exponential compute demands, Tongyu Electronic is collaborating with global innovators to solve the thermal paradox: how to sustain 100kW+/rack AI workloads while achieving net-zero targets.

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Next-Gen Cooling Breakthroughs in Focus:

Dynamic Liquid Cooling - 40% lower PUE vs air-cooled systems, validated in 50+ LLM training clusters

Silent Edge AI Solutions - <22dB operation with graphene-enhanced heat pipes for urban deployments

AI-Optimized Phase Change - Prevent thermal throttling in Hopper/H100 GPU racks at 80°C ambient

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Why Partner with Thermal Architects at GTC 2025?

Proven at Scale - 1,200+ HPC deployments including 8 exaFLOP AI supercomputers

Regulation-Ready - Meet EU Climate Law & US DOE Energy Star 5.0 standards

Virtual Thermal Modeling - Simulate heat loads for your AI infrastructure in 72hrs

 

Case Study Spotlight 

[Download report] How a Tier-1 cloud provider achieved:

 35% energy savings via two-phase immersion cooling

 0 thermal downtime in 12-month AI inference operations

 Carbon credits through waste heat recycling

Connect with Tongyu engineers at NVIDIA GTC 2025 (Mar 17-21, San Jose) to benchmark your thermal strategy:
 info@tongyu-group.com 

 

Linda / sales director

●  Tel: 86-769-26626558

●  Whatsapp: +86-15818382164

●  Email: info@tongyu-group.com

●  Website: www.tongyucooler.com

●  Factory name: Dongguan Tongyu Electronics Co., Ltd.

●  Address:

- Vietnam: Que Vo Town, Bac Ninh Province.

- China: DongGuan City, GuangDong Province.