Pasi peiyo IGBT module marongero, iro chairo simba rinopihwa nemutengi muCAD kudhirowa: Yese IGBT yekupisa masosi akaiswa zvakafanana pane ino IGBT zvinhu layer, yakagadzirwa nesilicon.

Iyo IGBT module inomisikidzwa sezvizvi, ine chaiyo simba ratings inopiwa muCAD diagram kubva kumutengi. Simba rekudzivirira rinogadziriswa ku120W.

Dhizaini Paramita: Chikumbiro
CPU Tsanangudzo: AMD SP5, 400W*2
Ambient Tembiricha (°C): 35
Mvura Inotonhorera: 25% PGW (Deionized Mvura + Inhibitor + Biocide)
Inlet Mvura Tembiricha (°C):40
Flow Rate (LPM): 1.0 series yekubatanidza

CPU Tsanangudzo: EGS, 385W * 2
Ambient Tembiricha (°C):35
Inotonhorera Fluid: PG25 kana Deionized Mvura
Inlet Mvura Tembiricha (°C):40
Flow Rate (LPM):2.4Parallel + Series.

Mainboard thermal source chikamu inofananidzwa seimwe yekupisa kupisa.

Magadzirirwo ekutanga: Shandisa mhando mbiri dzefani dzakapihwa nemutengi, 3004 uye 3007. Iyo casing yakarerutswa zvishoma, uye screws, interfaces, uye zvimwe zvikamu zve mainboard hazvibatanidzwe kubva pakuenzanisa scope.

Magadzirirwo ekutanga: Shandisa mhando mbiri dzefani dzakapihwa nemutengi, 3004 uye 3007. Iyo casing yakarerutswa zvishoma, uye screws, interfaces, uye zvimwe zvikamu zve mainboard hazvibatanidzwe kubva pakuenzanisa scope.

Simulation Parameters:

1. Ambient tembiricha: 50 ° C, hapana mhepo yekunze.
2. Thermal interface zvinhu: 6W.
3. Thermal simba dissipation sezvinoratidzwa mufananidzo pazasi.
4. Inlet uye outlet ventilation gomba kuvhura ratio: 60%.

Kureba: 59.5mm
zvinhu: Aluminium substrate (Series 1)
Kupisa Simba Kushandisa: 220W
Ambient Tembiricha: 35 ℃

Kureba: 59.5mm
zvinhu: Aluminium substrate (Series 1)
Kupisa Simba Kushandisa: 220W
Ambient Tembiricha: 35 ℃

Zvinoenderana neakakodzera paramita uye mhando dzakapihwa, tembiricha yekukwira inogona kunyatso kudzora mukati me25 ℃ kana uchishandisa ambient tembiricha ye16-20 ℃.