Tlhahisoleseding ea morero

Tlas'a li-module tsa IGBT, matla a khethehileng a fanoa ke moreki setšoantšong sa CAD:

Lisebelisoa le conductivity ea mocheso ea likarolo tse fapaneng tsa chip ea IGBT.

- Matla a khethehileng a IGBT

Moqapi oa Pele

- 50% ethylene glycol aqueous solution, e nang le mocheso oa metsi a kenang ka hare ho likhato tse 50, tekanyo ea phallo ea 25L / min, le mocheso o moholo oa metsi a tsoang - Thepa ea poleiti e pholileng ka metsi e behiloe ho aluminium 6061.

- Tlas'a moralo oa pele oa mocha oa phallo, lenonyeletso le bohareng la solder le botenya ba 0.4mm, 'me lekhalo ke 1.2mm le lepheo le kopaneng.

Ketsiso Liphetho

- Liphetho tsa Ketsiso: Mocheso o ka pele oa Leru 'mapa

- Metsi a pholileng a Plate Temperature Cloud Map, e nang le mocheso o phahameng oa likhato tse 113.43 sebakeng sa ho qetela sa ho kopana le IGBT.

- Fluid Temperature Cloud Map 20221202, sekhahla sa phallo 25L/min.
- Metsi a kenang, mocheso oa 50 degress
- Metsi a tsoang, mocheso oa likhato tse 61
- Fluid Pressure Cloud Map 20221202, sekhahla sa phallo 25L / min.
- Ho theoha ha khatello ea metsi ho tsoa ho 18.4 KPa.