Water Cooler PS-15 For INTEL
Brazing heatsinksTongyu
The process of brazing heatsinks involves joining two metal parts, often a heatsink and its complementary base, with the help of a filler metal. This filler metal, heated to a temperature below that of the base materials, flows seamlessly into the joint area, creating a solid, conductive bond that enhances thermal efficiency. This brazing method is particularly valued for its excellent thermal conductivity and structural durability, making it ideal for high-performance electronic devices. Brazing also stands out in applications where heatsinks have complex geometries or multi-layered designs, providing consistent heat management under demanding conditions.

Product DescriptionTongyu
Application |
INTEL CPU in the server |
Material |
AL6063+C1100 |
Weight |
1.55kg |
Power |
1000W |
Thermal Resistance |
0.036°C/W |
Sizes |
280*200*65mm |
Process |
Brazing |
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The PS-15 Liquid Cooler is engineered specifically for Intel CPU servers, providing advanced thermal management in high-performance computing environments. Its dual contact surface design ensures efficient heat dissipation from multiple components, making it ideal for applications requiring precise thermal control, such as data centers, cloud servers, and AI computing systems. With a 1000W cooling capacity and a thermal resistance of just 0.036°C/W, the PS-15 supports reliable operation under demanding workloads, ensuring system stability and longevity. The brazing construction and robust materials make it suitable for high-density server platforms, effectively addressing thermal challenges in compact installations.