Ulwazi Lwephrojekthi
Ngaphansi kwezilungiselelo zemojuli ye-IGBT, amandla athile anikezwa ikhasimende kumdwebo we-CAD:
Izinto kanye ne-thermal conductivity yezendlalelo ezihlukahlukene ze-chip ye-IGBT.


- Amandla Aqondile we-IGBT

Idizayini Yokuqala
Isixazululo se-aqueous se-ethylene glycol esingu-50%, esinokushisa kwamanzi okungena ngaphakathi kwama-degree angu-50, izinga lokugeleza lika-25L/min, kanye nezinga lokushisa eliphakeme lokuphuma kwamanzi - Impahla yepuleti epholiswe ngamanzi isethelwe ku-aluminium 6061.


- Ngaphansi komklamo wokuqala wesiteshi sokugeleza, isihlanganisi se-solder esimaphakathi siwugqinsi ongu-0.4mm, futhi igebe lingu-1.2mm elinephiko elixhumene.
Ukulingisa Imiphumela
- Ukulingisa Imiphumela: I-Front Temperature Cloud Map



- I-Plate Temperature Cloud Map epholile ngamanzi, enezinga lokushisa eliphakeme elingu-113.43 degrees endaweni yokugcina yokuxhumana ye-IGBT.


- I-Fluid Temperature Cloud Map 20221202, izinga lokugeleza elingu-25L/min.
- Amanzi angenayo, izinga lokushisa elingu-50 degress
- Amanzi okukhipha, izinga lokushisa elingu-61 degrees
- I-Fluid Pressure Cloud Map 20221202, izinga lokugeleza 25L/min.
- Ukwehla komfutho wamanzi e-inlet-outlet: 18.4 KPa.

