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Tongyu Electronicsrzr

Custom

Custom HEATSINK

A one-size-fits-all solution is ineffective for cooling electronic devices. Each device has its own unique dimensions, power needs, and thermal properties. This is where custom heatsinks become essential.

Custom heatsinks are tailored to the specific requirements of your device, ensuring optimal thermal performance. By taking into account factors like power dissipation, airflow, and available space, we design heatsinks that enhance heat dissipation while reducing the risk of overheating.

With our extensive experience, we specialize in the production of custom heatsinks. We work closely with clients to understand their specific needs and manufacture heatsinks that perfectly fit their devices. Whether you require a heatsink for a computer processor, power electronics, or another application, we have the knowledge and skills to achieve outstanding results.
Custom HEATSINK

What is a Custom Heatsink? our goals


With this information, Tongyu Thermal products can collaborate with your team to identify the most suitable custom heatsink solution for your thermal needs.

Without adequate cooling, components can overheat and fail, resulting in expensive repairs or complete breakdowns. Custom-designed heatsinks cater specifically to the unique requirements of individual devices or applications. These heatsinks can be constructed from a variety of materials, such as aluminum and copper, and can be shaped in numerous ways to accommodate even the most intricate electronic systems.

Tongyu Thermal Products can use one of our wide range of standard heatsinks, and then modify to meet the thermal application requirements. By customizing a standard heatsink, we not only lower costs but also significantly reduce prototype development time. For larger heatsinks, we can assess existing extrusions before they are cut for a standard design. If a standard heatsink cannot be adapted, our engineering team will create a custom solution using the most suitable manufacturing techniques.

Skived fin heat sink

Skived fin heat sink

A skived custom heatsink is crafted using specialized cutting tools and a precise shaving process to create a heatsink from a solid block of material, like copper or aluminum. The outcome is typically a thin-finned heatsink featuring a high density of uniformly shaped and evenly spaced fins.
Extruded heat sink

Extruded heat sink

An extruded aluminum heatsink is among the most widely used and cost-effective methods for heatsink production. Tongyu offers a broad range of extruded heatsink solutions that can be tailored with different mounting options, pre-applied thermal interface materials, and additional features to simplify integration into your PCB.
Heat pipe heat sink

Heat pipe heat sink

A standard heat pipe features a vacuum-sealed tube constructed from a material compatible with the working fluid, such as copper for water-based heat pipes. Heat pipes efficiently transfer heat to a cooler area, minimizing temperature increases within the pipe itself.
Die Casting heat sink

Die Casting heat sink

A die casting heatsink is produced by injecting molten metal under high pressure into a precisely shaped mold made from hardened tool steel. The high costs associated with casting equipment and metal dies typically confine this process to high-volume production applications.
3DVC heat sink

3DVC heat sink

A Vapor Chamber functions like a flat heat pipe, distributing heat quickly throughout its structure. This advanced technology ensures that the base of the heatsink remains at a uniform temperature. It is most effective when the heat source is smaller than the area of the vapor chamber's base.
Friction welding heat sink

Friction welding heat sink

Friction welding (friction stir welding) refers to the use of high-speed rotation of the heat generated by the friction welding set and the workpiece to be partial plastic welding materials, when welded with moving forward along the welding interface, is plastic material under the effect of welding with the rotation of the friction force from front to rear of welding fixture, and the welding formed under the extrusion of density of the solid phase welding seam.
Liquid cooling heat sink

Liquid cooling heat sink

The Liquid cooling system uses a pump to circulate the coolant in the heat pipe and dissipate heat. The decalescence part on the radiator (called the decalescence box in the liquid cooling system) is used to absorb heat from the computer CPU, graphics card, lithium battery, 5G communication equipment, UPS and energy storage system, large photovoltaic inverter heat dissipation, SVG/SVC heat dissipation. The heat absorbed by the decalescence part is vented out through a radiator designed on the back of the heat source.
Stamping heat sink

Stamping heat sink

Stamped heat sinks provide a cost-effective way to enhance heat transfer in board-level products by increasing surface area. Created through progressive stamping processes, these heat sinks feature specific designs tailored for various electronic packages, ensuring optimal fit and function. They offer multiple mounting options, including solder tabs, pins, interference fits with clips, and through-hole hardware. Many stamped heat sinks also have a finish that improves heat radiation and thermal performance for natural convection applications.

Folded fin heat sink

Folded fin heat sink

Folded fin stock is produced through a progressive stamping process that transforms sheet metal into fin stacks, enhancing surface area for better cooling as heat transfer fins. Tongyu customizes the material, configuration, thickness, and density of these fins to improve the performance of thermal management solutions like heat exchangers, heat sinks, and vacuum brazed cold plates. Our manufacturing flexibility and thermal innovation enable us to enhance the thermal efficiency of existing cooling technologies, eliminating the need to upgrade to more advanced cooling solutions for higher heat loads.

Custom Heatsink Design

When our engineering team begins designing a custom heatsink, it is crucial for the customer to consider several key factors, including:

Space
Available Space for Heatsink Installation: Width, Length, and Height
Power
Power Requirements in Watts and Size
Airflow
Airflow Velocity in LFM and Direction
Maximum Operating Case or Junction Temperature
Maximum Operating Case or Junction Temperature
Local Ambient Temperature
Local Ambient Temperature
Preferred Attachment Method
Preferred Attachment Method
Estimated Annual Usage and Budget
Estimated Annual Usage and Budget
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Tongyu Electronics: Your End-to-End Thermal Management Solution PartnerUnlocking Advanced Cooling Solutions from Concept to Production

At Tongyu Electronics, we don't just manufacture heatsinks; we engineer comprehensive thermal solutions tailored to your unique challenges. As a trusted partner in advanced cooling technology, we guide you through a meticulous, end-to-end process, ensuring optimal performance and reliability for your products.

Get to know us

Our Partners:

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Our Integrated Solution Process Tongyu

Our proven methodology covers every stage of product development, ensuring precision, quality, and efficiency:

Phase 0

Project Initiation & Feasibility Assessment

Deep dive into your technical challenges, performance needs, and business goals. Includes customer requirements analysis, market research, patent search, APQP team formation, quality standards confirmation, DFM analysis, simulation, and reliability planning.
Project Initiation
Phase 01

Design Development & Supply Chain Establishment

Detailed product design and robust supply chain setup. Focuses on design target setting, 3D/2D drawing creation, initial characteristics analysis, BOM management, process flow design, DFMEA, and comprehensive supplier evaluation.
Design Development & Supply Chain Establishment
Phase 02

Prototype Development & Validation

Transforming concepts into tangible prototypes with rigorous testing. Involves drawing management, prototype manufacturing, First Article Inspection (FAI), performance testing (especially thermal resistance), packaging design, RoHS confirmation, and DVP/DVR.
Prototype Development & Validation
Phase 03

Pre-Production & Process Validation

Establishing and validating the manufacturing process for consistency. Key activities include PFMEA, trial production control plan (PMP), system BOM finalization, mold development, material management, capacity planning, full dimensional measurement, SOP development, CPK analysis, ORT planning, and equipment preparation.
3Pre-Production & Process Validation
Phase 04

Trial Production Execution & Mass Production Preparation

Verifying the entire production system for efficiency and quality. Covers incoming inspection, Golden Sample issuance, process capability validation (CPK, CMK), MSA, SPC implementation, trial production summary, packaging validation, and official document release.
4Trial Production Execution
Phase 05

Mass Production Management & Continuous Improvement

Ensuring sustained quality and efficiency in full-scale production. Includes project handover, production reporting, equipment maintenance, statistical process control, and robust change management (5M1E).
5Mass Production Management
Phase 06

Product Lifecycle Management

Comprehensive management throughout the product's lifespan, from documentation to end-of-life. Focuses on document & data management and end-of-life management.fficiency:
6roduct Lifecycle Management
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Project Initiation & Feasibility Assessment

01

Design Development & Supply Chain Establishment

02

Prototype Development & Validation

03

Pre-Production & Process Validation

04

Trial Production Execution & Mass Production Preparation

05

Mass Production Management & Continuous Improvement

06

Product Lifecycle Management

Why Partner with Tongyu Electronics?

✅ Full-Process Quality Control: Our rigorous quality system, incorporating DFMEA, PFMEA, CPK, MSA, and SPC, guarantees product excellence.

✅ Expert Team: A dedicated team of R&D, DQE, PE, Purchasing, SQE, PM, Manufacturing, QC, and Environmental Specialists ensures seamless execution.

✅ Robust Supply Chain: Comprehensive supplier evaluation and management for consistent quality and reliability.

✅ Advanced Testing: State-of-the-art equipment and standardized procedures for precise thermal resistance and reliability validation.

✅ Continuous Innovation: Commitment to R&D and process optimization for cutting-edge thermal solutions.

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Your Value, Our Commitment:

✔ One-Stop Solution: Simplify your project with our end-to-end thermal management services.

✔ Customized Design: Tailored solutions optimized for your specific application, performance, and cost targets.

✔ Guaranteed Quality: Reliable products that perform consistently in diverse environments.

✔ Rapid Response: Efficient processes and flexible support to meet your dynamic needs.
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Ready to Innovate Together?

Contact our experts today to discuss your thermal challenges and discover how Tongyu Electronics can be your reliable partner in advanced cooling. Let's engineer success, together.

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