Cpu Air Cooler PS-01 For INTEL
Soldering heatsinksTongyu
Soldering heatsinks is a process used to create a strong thermal connection between the heatsink and the component it is cooling. By using a solder material, typically a metal alloy, the heatsink is bonded directly to the surface of the component. This method enhances heat transfer efficiency by minimizing thermal resistance, creating a seamless path for heat dissipation. Soldering is particularly useful in high-power applications where superior cooling performance is essential.

Product DescriptionTongyu
Application |
Intel platforms Server |
Material |
AL1100+AL6063+C1020 |
Weight |
0.86kg |
Power |
550W |
Heat Pipes |
11*6mm |
Thermal Resistance |
0.067°C/W |
Sizes |
190*180*65mm |
Process |
Stamped, Soldering, Heat pipes |
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Application Scenarios for Air Cooler PS-01 For INTEL
The PS-01 Air Cooler is essential for Intel-based servers in high-performance computing systems where effective cooling is crucial. Designed for powerful servers, it delivers optimal heat dissipation with its 550W cooling capacity, preventing overheating and maintaining reliable performance in intensive environments such as data centers, enterprise networks, and cloud computing. With 11 heat pipes and a thermal resistance of 0.067°C/W, the PS-01 ensures maximum airflow and cooling efficiency, making it ideal for scalable, energy-efficient server operations.

Automotive Vehicle
Energy/Photovoltaic
Networking/Consumer Electronics
PC/Server





