Liquid Cpu Cooler PS-05 for AMD
Brazing heatsinksTongyu
Ideal for high-performance computing environments, the PS-05 provides exceptional cooling efficiency, helping to prolong the lifespan of hardware and maintain top-level performance. It’s the perfect choice for organizations looking to enhance their server cooling capabilities in mission-critical operations.
Brazing heatsinks is a technique used to join two metal parts, like a heatsink and a component or base, by melting a filler metal at a temperature lower than the base metals' melting point. The filler metal flows into the joint, forming a strong and conductive bond that improves heat transfer. This method is frequently employed in applications demanding high thermal conductivity and durability, such as high-power electronics. Brazing offers outstanding thermal performance and is often the preferred choice for connecting heatsinks with intricate designs or multiple layers.

Product DescriptionTongyu
Application |
AMD in the server |
Material |
AL1100+AL6063+C1100 |
Weight |
2.5kg |
Power |
830W |
Thermal Resistance |
0.038°C/W |
Sizes |
450*185*55mm |
Process |
Brazing |
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Application Scenarios for Liquid Cooler PS-05 For AMD
The PS-05 Liquid Cooler is designed for mission-critical server environments that require robust cooling solutions. It is ideal for applications such as data centers, cloud computing, high-performance computing (HPC), and enterprise-level server infrastructures. Whether handling intensive AI workloads, large-scale database management, or virtualization tasks, the PS-05 ensures reliable heat dissipation, maintaining optimal system performance under demanding conditions.

Automotive Vehicle
Energy/Photovoltaic
Networking/Consumer Electronics
PC/Server





