Heatsink PS-12 For Server AMD
Soldering heatsinksTongyu
Soldering heatsinks involves creating a robust thermal interface by attaching the heatsink directly to the component with a solder alloy. This process significantly reduces thermal resistance by forming a seamless bond, allowing for efficient heat dissipation from the component to the heatsink. The strong thermal connection provided by soldering is particularly advantageous in high-power applications where effective cooling is critical to prevent overheating and maintain optimal performance. This technique is preferred in settings where maximum heat transfer efficiency and reliability are essential.

Product DescriptionTongyu
Application |
AMD platforms Server |
Material |
AL1100+AL6063+C1020 |
Weight |
0.7kg |
Power |
450W |
Heat Pipes |
10*6mm |
Thermal Resistance |
0.053°C/W |
Sizes |
185*193*65mm |
Process |
Soldering, Heat pipes |
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The PS-12 is designed for high-performance server environments where AMD CPUs operate under sustained heavy workloads, requiring exceptional thermal management. It is ideally suited for data centers, enterprise servers, and HPC (High-Performance Computing) platforms that rely on robust cooling solutions to maintain stability, optimize processing speeds, and prevent thermal throttling. With its powerful cooling capacity of 450W and low thermal resistance, the PS-12 effectively dissipates the intense heat generated by high-power AMD processors, making it essential for applications where system reliability and uptime are critical. This cooling solution helps maintain optimal performance, even in dense server configurations, contributing to enhanced computational efficiency and reduced risk of overheating-related failures.