Heatsink PS-13 For Server INTEL
Soldering heatsinksTongyu
Soldering heatsinks is a process used to create a strong thermal connection between the heatsink and the component it is cooling. By using a solder material, typically a metal alloy, the heatsink is bonded directly to the surface of the component. This method enhances heat transfer efficiency by minimizing thermal resistance, creating a seamless path for heat dissipation. Soldering is particularly useful in high-power applications where superior cooling performance is essential.

Product DescriptionTongyu
Application |
Intel platforms Server |
Material |
AL1100+AL6063+C1020 |
Weight |
2.2kg |
Power |
550W |
Heat Pipes |
15*6mm |
Thermal Resistance |
0.061°C/W |
Sizes |
430*250*80mm |
Process |
Soldering, Heat pipes |
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The PS-13 CPU cooler is designed for advanced server environments where Intel processors are used in high-performance and mission-critical applications. It is ideal for data centers, cloud computing infrastructure, and enterprise-level servers that require consistent, reliable heat dissipation to maintain optimal performance. With its high cooling capacity of 550W and 15 heat pipes, the PS-13 excels in managing the heat produced by intensive, sustained workloads. This makes it an excellent choice for applications in AI processing, big data analytics, and high-frequency trading platforms, where efficient cooling directly impacts server reliability and longevity.